Low-stain polishing composition
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United States of America Patent
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Apr 25, 2017
Grant Date -
Aug 27, 2009
app pub date -
Feb 22, 2008
filing date -
Feb 22, 2008
priority date (Note) -
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Abstract
The invention is an aqueous composition useful for chemical mechanical polishing of a patterned semiconductor wafer containing a copper interconnect metal. The aqueous composition includes an oxidizer, an inhibitor for the copper interconnect metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 complexing agent for the copper interconnect metal, 0 to 15 weight percent phosphorus compound, 0.05 to 20 weight percent of an acid compound that is capable of complexing copper ions, and water; and the solution has an acidic pH.
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