Etching liquid, etching method, and method of manufacturing solder bump

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United States of America Patent

PATENT NO 9633898
APP PUB NO 20160042993A1
SERIAL NO

14920104

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Abstract

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An etching liquid which can selectively remove only a copper layer in an etching process of a multilayer structure including a cobalt layer and the copper layer is disclosed. The etching liquid is an etching liquid for etching the copper layer in the multilayer structure including the copper layer and the cobalt layer. This etching liquid includes at least one acid selected from a group consisting of citric acid, oxalic acid, malic acid, and malonic acid, and hydrogen peroxide, the etching liquid having pH in a range of 4.3 to 5.5.

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Patent Owner(s)

Patent OwnerAddress
EBARA CORPORATIONOTA-KU TOKYO 144-8510

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kurashina, Keiichi Tokyo, JP 22 169
Susaki, Akira Tokyo, JP 18 138

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