Apparatus and method for enhancing the cool down of radiatively heated substrates

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United States of America Patent

PATENT NO 9640412
APP PUB NO 20110123178A1
SERIAL NO

12622736

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Abstract

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The present invention generally relates to methods and apparatus for processing substrates. Embodiments of the invention include apparatuses for processing a substrate comprising a dynamic heat sink that is substantially transparent to light from a radiant heat source, the dynamic heat sink being positioned near the substrate so the two are coupled. Additional embodiments of the invention are directed to methods of processing a substrate using the apparatuses described.

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Patent Owner(s)

  • APPLIED MATERIALS, INC.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aderhold, Wolfgang Cupertino, US 30 423
Koelmel, Blake R Mountain View, US 12 559
Ranish, Joseph M San Jose, US 183 4580

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