Package for a surface-mount semiconductor device and manufacturing method thereof
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United States of America Patent
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May 2, 2017
Issued Date -
N/A
app pub date -
Aug 12, 2016
filing date -
Dec 10, 2014
priority date (Note) -
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Abstract
A method for manufacturing a surface-mount electronic device includes making a first partial cut from a bottom of an assembly that includes a first semiconductor body that is disposed on a first die pad, a second semiconductor body that is disposed on a second die pad, and a plurality of terminal regions that is disposed between the first and second die pads. The first partial cut forms a recess by removing a portion of each of the terminal regions. The recess is defined by a transverse wall, a first sidewall, and a second sidewall. The first and second sidewalls and the transverse wall are coated with an anti-oxidation layer. A second partial cut is made from the top, where the second partial cut removes the transverse wall, separates the first and second semiconductor bodies, and has a width that is greater than a width of the first partial cut.
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