Chip component

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9646747
SERIAL NO

14373900

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A chip component includes a substrate, an element circuit network including a plurality of element parts formed on the substrate, an external connection electrode provided on a surface of the substrate to provide external connection for the element circuit network, a plurality of fuses formed on the substrate and disconnectably connecting each of the plurality of element parts to the external connection electrode, a solder layer formed on an external connection terminal of the external connection electrode and a resin film which covers the surface of the substrate and other surface which intersects the surface of the substrate.

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Patent Owner(s)

  • ROHM CO., LTD.

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kondo, Yasuhiro Kyoto, JP 132 866
Matsuura, Katsuya Kyoto, JP 19 83
Tamagawa, Hiroshi Kyoto, JP 25 82
Yamamoto, Hiroki Kyoto, JP 375 4488

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