Sealing groove methods for semiconductor equipment

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United States of America Patent

PATENT NO 9646807
APP PUB NO 20150047786A1
SERIAL NO

14456146

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Abstract

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In one embodiment, a surface having a sealing groove formed therein. The sealing groove is configured to accept an elastomeric seal. The sealing groove includes a first portion having a full dovetail profile and at least on a second portion having a half dovetail profile.

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Patent Owner(s)

Patent OwnerAddress
APPLIED MATERIALS INC3050 BOWERS AVENUE SANTA CLARA CA 95054-3299

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liang, Qiwei Fremont, US 75 3536
Lubomirsky, Dmitry Cupertino, US 252 13738

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