Heating plate with heating zones for substrate processing and method of use thereof
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United States of America Patent
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May 9, 2017
Grant Date -
Feb 13, 2014
app pub date -
Oct 17, 2013
filing date -
Oct 21, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A heating plate for use in a substrate support is configured to provide temperature profile control of a substrate supported on the substrate support in a vacuum chamber of a substrate processing apparatus. The heating plate includes an independently controllable heater zones operable to tune a temperature profile on an upper surface of the heating plate. The heater zones are each powered by two or more power lines wherein each power line is electrically connected to a different group of the heater zones and each respective heater zone is electrically connected to a different pair of power lines.
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