Flexible printed circuit board and method for manufacturing same
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United States of America Patent
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May 9, 2017
Grant Date -
Dec 10, 2015
app pub date -
Dec 31, 2013
filing date -
Dec 31, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
The present invention relates to a method for manufacturing a flexible printed circuit board and a flexible printed circuit board manufactured by using the same. A circuit pattern is formed with a conductive paste on one surface of a base material, and the circuit pattern is sintered at a temperature of 290° C. to 420° C. to manufacture the flexible printed circuit board. As such, manufacturing costs can be reduced and productivity can be improved through a simple yet convenient process. Also, the circuit pattern is formed without a plating process, such that the problem of circuit pattern separation occurring during the plating process can be addressed and product reliability can be improved.
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