Method and device for electrically contacting terminal faces of two substrates by laser soldering using a gaseous flux medium

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United States of America Patent

PATENT NO 9649711
SERIAL NO

13982837

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for electrically contacting terminal faces of two substrates, such as a chip and a carrier substrate, includes two successive phases. In a first phase, the chip is positioned with its terminal faces against terminal faces of the substrate and laser energy is applied to the chip at the rear. In a second phase, a flux medium is applied and laser energy is applied to the rear of the chip to cause reflow. The device for performing the second phase of the method comprises a carrier table and a housing, which form a housing interior with a top side of the carrier table which receives the component arrangement, and a laser light source, which is oriented so that the laser radiation impinges on the rear side of the first substrate.

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Patent Owner(s)

Patent OwnerAddress
PAC TECH - PACKAGING TECHNOLOGIES GMBHAM SCHLANGENHORST 7-9 NAUEN D-14641

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Azdasht, Ghassem Berlin, DE 59 605

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