Molding packaging material and molded case

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9649827
APP PUB NO 20160089861A1
SERIAL NO

14868498

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Abstract

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A molding packaging material includes an outer substrate layer made of a heat-resistant resin, an inner sealant layer made of a thermoplastic resin, a metallic foil layer provided between the outer substrate layer and the inner sealant layer, and a protection coat layer formed on a side opposite to the metallic foil layer side of the outer substrate layer. The protection coat layer is made of a resin composition including a main resin containing a phenoxy resin and a urethane resin, and a curing agent, and has a thickness of 0.1 μm to 10 μm.

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Patent Owner(s)

Patent OwnerAddress
RESONAC PACKAGING CORPORATION60 KIYOSAKICHO HIKONE-SHI SHIGA 529-1156

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Minamibori, Yuji Isehara, JP 14 30
Wang, Honglin Isehara, JP 13 39

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