Thermal exchange food processing device and method of producing same
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United States of America Patent
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May 16, 2017
Grant Date -
Jun 12, 2014
app pub date -
Dec 6, 2013
filing date -
Dec 7, 2012
priority date (Note) -
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Abstract
A thermal exchange food processing device includes a thermal conductive body, a thermal insulation layer and a phase change material. The thermal conductive body has an acting region and an inner thermal conductive region corresponding to, and in thermal connection with, the acting region. The thermal insulation layer has a lower thermal conductivity coefficient than the thermal conductive body and encapsulates, at least in part, the thermal conductive body, so that the acting region of the thermal conductive body is exposed while the remaining regions of the thermal conductive body other than the acting region are thermally insulated from ambient temperature. The thermal conductive body, alone or together with the thermal insulation layer, defines an accommodation space, and the inner thermal conductive region is situated to face the accommodation space. The phase change material is within the accommodation space.
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