Semiconductor device and manufacturing method thereof
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United States of America Patent
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May 16, 2017
Grant Date -
Mar 10, 2016
app pub date -
Dec 17, 2014
filing date -
Sep 9, 2014
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A semiconductor device according to the present embodiment includes a plurality of wires. A plurality of wire drawing pads are provided correspondingly to the wires and electrically connecting a plurality of contacts to the wires, respectively. First space portions widen toward a first direction from the wires to the wire drawing pads and are located between adjacent ones of the wire drawing pads in a connection region between the wires and the wire drawing pads. Second space portions are provided at edge portions of the wire drawing pads. Air gaps or insulating layers are provided in the first space portions and the second space portions.
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