Bulk fin STI formation

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United States of America Patent

PATENT NO 9653359
SERIAL NO

14869066

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Abstract

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Techniques for STI in fin device structures formed on bulk substrates are provided. In one aspect, a method of forming a fin device in a bulk substrate includes the steps of: forming fins and trenches in between the fins in the bulk substrate; and annealing the bulk substrate in an oxygen ambient under conditions sufficient to form a thermal oxide on sidewalls of the fins and which completely fills the trenches, wherein the thermal oxide forms a STI region between each of the fins. A method of forming a fin device in a bulk substrate is also provided where a deposited STI oxide is used in combination with a thermal oxide. A fin device is also provided.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cheng, Kangguo Schenectady, US 3073 29638
Li, Juntao Cohoes, US 578 3109
Miao, Xin Guilderland, US 355 2236

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