Electronic component and manufacturing method therefor
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United States of America Patent
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May 16, 2017
Grant Date -
May 5, 2016
app pub date -
Jan 13, 2016
filing date -
Jul 17, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
In an electronic component, a functional circuit, signal wiring electrically connected to the functional circuit, and ground wiring electrically connected to the functional circuit and electrically connected to a ground potential are located on one surface of a circuit substrate, a frame member is provided to secure a region between itself and an outer peripheral edge of a first main surface of the circuit substrate and so as to surround the functional circuit, the ground wiring extends from inside to outside the frame member, and a shield member extends from a second main surface of the circuit substrate to a region on the first main surface via the side surfaces, the shield member being electrically connected to the ground wiring in the region outside the frame member.
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