Inorganic adhesive composition and hermetic sealing method using same

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United States of America Patent

PATENT NO 9656908
APP PUB NO 20150166404A1
SERIAL NO

14407254

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Abstract

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The present invention relates to an inorganic adhesive composition and to a hermetic sealing method, and more specifically relates to an inorganic adhesive composition with which an organic solvent is not used and to a hermetic sealing method using same. To this end, the present invention provides an inorganic adhesive composition comprising: between 20 and 80 parts by weight of a water glass diluted solution containing between 60 and 90 parts by weight of water glass (Na2SiO2); between 20 and 80 parts by weight of a refractory inorganic filler; and a black pigment.

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Patent Owner(s)

  • CORNING PRECISION MATERIALS CO., LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Cha, Jaemin Chungcheongnam-do, KR 7 115
Kim, Jhee-Mann Chungcheongnam-do, KR 11 7
Lee, Jaeho Chungcheongnam-do, KR 300 2765
Lee, Kiyeon Chungcheongnam-do, KR 15 34

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