Waterborne adhesives for reduced basis weight multilayer substrates and use thereof

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United States of America Patent

PATENT NO 9657200
SERIAL NO

13826451

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Abstract

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The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.

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Patent Owner(s)

Patent OwnerAddress
HENKEL AG & CO KGAARUHRSTRASSE 19 HAMBURG 22761

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Tianjian Hillsborough, US 35 212
Meccia, John Ringoes, US 17 75
Thompson, Kristina Clinton, US 18 89
Waski, Daniel Elmhurst, US 23 162

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