Composition for etching treatment of resin material

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9657226
APP PUB NO 20150344777A1
SERIAL NO

14655555

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The present invention provides a composition for etching treatment of a resin material, the composition comprising an aqueous solution having a permanganate ion concentration of 0.2 mmol/L or more and a total acid concentration of 10 mol/L or more, and the aqueous solution satisfying at least one of the following conditions (1) to (3):

    (1) containing an organic sulfonic acid in an amount of 1.5 mol/L or more,(2) setting the divalent manganese ion molar concentration to 15 or more times higher than the permanganate ion molar concentration, and(3) setting the addition amount of an anhydrous magnesium salt to 0.1 to 1 mol/L.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
OKUNO CHEMICAL INDUSTRIES CO LTDOSAKA-SHI OSAKA 541-0045

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kita, Koji Osaka, JP 80 702
Nagamine, Shingo Osaka, JP 6 29
Otsuka, Kuniaki Osaka, JP 16 188

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation

Maintenance Fees

Fee Large entity fee small entity fee micro entity fee due date
7.5 Year Payment $3600.00 $1800.00 $900.00 Nov 23, 2024
11.5 Year Payment $7400.00 $3700.00 $1850.00 Nov 23, 2028
Fee Large entity fee small entity fee micro entity fee
Surcharge - 7.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge - 11.5 year - Late payment within 6 months $160.00 $80.00 $40.00
Surcharge after expiration - Late payment is unavoidable $700.00 $350.00 $175.00
Surcharge after expiration - Late payment is unintentional $1,640.00 $820.00 $410.00