Apparatus for treating surfaces of wafer-shaped articles

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United States of America Patent

PATENT NO 9657397
SERIAL NO

14144846

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Abstract

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An apparatus for processing wafer-shaped articles comprises a closed process chamber providing a gas-tight enclosure. A rotary chuck is located within the closed process chamber, the rotary chuck being adapted to hold a wafer shaped article thereon. A lid is secured to an upper part of the closed process chamber, the lid comprising an upper plate formed from a composite fiber-reinforced material and a lower plate that faces into the process chamber and is formed from a chemically-resistant plastic.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH AGSEZ-STRASSE 1 9500 VILLACH 9500

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Gleissner, Andreas Dobriach, AT 44 390

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