Radiator, solderless interconnect thereof and grounding element thereof
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United States of America Patent
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May 23, 2017
Grant Date -
Jun 23, 2016
app pub date -
Dec 22, 2014
filing date -
Dec 22, 2014
priority date (Note) -
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status (Latency Note)
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Abstract
A radiator includes an aperture plate defining multiple slots in first and second transverse directions, spring probes disposed within each of the multiple slots, printed circuit boards (PCBs) each having major and minor surfaces and being recessed on either side of multiple portions of one of the minor surfaces to define multiple pads plated with conductive pad material electrically interconnected with a PCB circuit and a grounding element. Each of the PCBs is disposed with the corresponding one of the minor surfaces inserted into a slot such that the PCBs form a crisscrossing pattern and the pads form horizontal blind-mate contacts with the spring probes that are in-plane with corresponding PCB planes. The grounding element is interposed between crisscrossing PCB pairs at complementary notches thereof.
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