Ultrasonic cleaning method and apparatus

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United States of America Patent

PATENT NO 9662686
APP PUB NO 20120073596A1
SERIAL NO

12889975

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Abstract

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A device and method for treating the surface of a semiconductor wafer provides a treatment fluid in the form of a dispersion of gas bubbles in a treatment liquid generated at acoustic pressures less than those required to induce cavitation in the treatment liquid. A resonator supplies ultrasonic or megasonic energy to the treatment fluid and is configured to create an interference pattern in the treatment fluid comprising regions of pressure amplitude minima and maxima at an interface of the treatment fluid and the semiconductor wafer.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH AGSEZ-STRASSE 1 9500 VILLACH 9500

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Holsteyns, Frank Ludwig Eksel, BE 2 13
Lippert, Alexander Villach, AT 12 44

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