Copper alloy and method of manufacturing copper alloy

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United States of America Patent

PATENT NO 9666325
APP PUB NO 20140190596A1
SERIAL NO

14008910

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Disclosed is a beryllium-free copper alloy having high strength, high electric conductivity and good bending workability and a method of manufacturing the copper alloy. Provided is a copper alloy having a composition represented by the composition formula by atom %: Cu100-a-b-c(Zr, Hf)a(Cr, Ni, Mn, Ta)b(Ti, Al)c [wherein 2.5≦a≦4.0, 0.1

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Patent Owner(s)

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TOHOKU UNIVERSITY1-1 KATAHIRA 2-CHOME AOBA-KU SENDAI-SHI MIYAGI 980-8577

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Inoue, Akihisa Sendai, JP 197 2954
Nishiyama, Nobuyuki Sendai, JP 13 203
Yamazaki, Haruko Sendai, JP 3 25

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