Method of collapse-free drying of high aspect ratio structures

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United States of America Patent

PATENT NO 9666427
APP PUB NO 20140373384A1
SERIAL NO

13924314

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Abstract

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A method, for drying an etched layer with a plurality of structures with etched spaces between the plurality of structures is provided. A liquid is provided within the spaces on the etched layer. The liquid is displaced with a drying solution with a solvent. Some of the solvent is removed from the drying solution to form a solid from the solution, wherein the solid at least fill half the height of the etched high aspect ratio spaces. The solid is removed.

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Patent Owner(s)

Patent OwnerAddress
LAM RESEARCH CORPORATION4650 CUSHING PARKWAY FREMONT CA 94538-6470

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hymes, Diane San Jose, US 15 114
Postel, Olivier B Riegersdorf, AT 7 80
Sirard, Stephen M Austin, US 21 120

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