Systems and methods for chemical mechanical planarization with photoluminescence quenching

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United States of America Patent

PATENT NO 9666496
SERIAL NO

14855447

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Abstract

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A method includes performing a chemical-mechanical planarization (CMP) on an article, providing a polishing fluid including luminescent particles capable of generating a fluorescent light in response to a light incident on the article, and detecting an intensity of the fluorescent light. An apparatus that is capable of performing the method and a system that includes the apparatus are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITEDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Liu, I-Shuo Hsinchu, TW 11 37

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