Process for forming package-on-package structures
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United States of America Patent
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May 30, 2017
Grant Date -
Oct 6, 2016
app pub date -
Jun 20, 2016
filing date -
Oct 17, 2011
priority date (Note) -
In Force
status (Latency Note)
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Abstract
A device includes an inter-layer dielectric, a device die under the inter-layer dielectric; and a die-attach film under the inter-layer dielectric and over the device die, wherein the die-attach film is attached to the device die. A plurality of redistribution lines includes portions level with the die-attach film. A plurality of Z-interconnects is electronically coupled to the device die and the plurality of redistribution lines. A polymer-comprising material is under the inter-layer dielectric. The device die, the die-attach film, and the plurality of Z-interconnects are disposed in the polymer-comprising material.
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