Composition and method for forming conductive pattern, and resin structure having conductive pattern thereon

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United States of America Patent

PATENT NO 9668342
APP PUB NO 20160128188A1
SERIAL NO

14895143

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Abstract

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The present invention relates to a composition for forming a conductive pattern which is capable of forming a fine conductive pattern reducing deterioration of mechanical-physical properties and having excellent adhesion strength onto a variety of polymeric resin products or resin layers, a method for forming the conductive pattern using the same, and a resin structure having the conductive pattern. The composition for forming a conductive pattern includes a polymer resin; and non-conductive metal compound particles including a first metal element and a second metal element, having a R3m or P63/mmc space group in crystal structure, and having a particle size of 0.1 to 20 μm, wherein a metal nuclei including the first metal or the second metal element or an ion thereof is formed from the non-conductive metal compound particles by electromagnetic irradiation.

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Patent Owner(s)

  • LG CHEM, LTD.

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Jun, Shin Hee Daejeon, KR 27 46
Jung, Sang Yun Daejeon, KR 21 77
Kim, Jae Hyun Daejeon, KR 230 1839
Park, Chee-Sung Daejeon, KR 18 33
Park, Cheol-Hee Daejeon, KR 78 222

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