Method of embedding a pre-assembled unit including a device into a flexible printed circuit and corresponding assembly
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United States of America Patent
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May 30, 2017
Issued Date -
N/A
app pub date -
Mar 15, 2013
filing date -
Mar 15, 2013
priority date (Note) -
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Abstract
A flexible printed circuit assembly, having a first flexible printed circuit having a first conductive layer and a device that is connected the first conductive layer; and a second flexible printed circuit having a second conductive layer, an insulating center layer, and a third conductive layer, the insulating center layer arranged in-between the second and the third conductive layers, the second conductive layer and the insulating center layer being removed to form an opening to expose an upper surface of the third conductive layer, wherein the first flexible printed circuit is arranged such that the device is accommodated inside the opening, a lower surface of the device being in thermal connection with the third conductive layer, and the first conductive layer is arranged to be in electrical connection with the second conductive layer.
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