Polyamideimide adhesives for printed circuit boards

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United States of America Patent

PATENT NO 9668360
APP PUB NO 20120222889A1
SERIAL NO

13504792

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to curable, liquid, adhesive compositions comprising polyamideimide resins for use in bonding layers of material in metal clad laminate materials for electronic components, such as flexible circuit boards. In particular, the invention relates to liquid adhesive compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

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Patent Owner(s)

  • SUN CHEMICAL B.V.;SUN CHEMICAL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Davis, Richard Charles Bath, GB 2 13
Ford, Simon Richard Bath, GB 3 14
Hall, Stephen Anthony Wells, GB 18 153
Klaus, Matthias Strausberg, DE 3 3
Ognibeni, Karl-Heinz Kirchheimbolanden, DE 3 31

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