Liquid coverlays for flexible printed circuit boards

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United States of America Patent

PATENT NO 9670306
APP PUB NO 20120000696A1
SERIAL NO

13256619

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention relates to curable liquid coverlay compositions comprising polyamideimide resins for use in curable compositions for use as protective coverlay coatings for metal clad laminate materials in electronic components, such as flexible circuit boards. In particular, the invention relates to liquid coverlay compositions comprising polyamideimides having a terminal isocyanate group blocked by a thermally-dissociatable isocyanate-blocking group and the use of such compositions in preparation of flexible electronic components.

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Patent Owner(s)

  • SUN CHEMICAL CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Davis, Richard Charles Bath and North, GB 2 13
Ford, Simon Richard Bath and North, GB 3 14
Hall, Stephen Anthony Wells, GB 18 153
Klaus, Matthias Strausberg, DE 3 3
Ognibeni, Karl-Heinz Kirchheimbolanden, DE 3 31

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