Base film and pressure-sensitive adhesive sheet provided therewith
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United States of America Patent
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Jun 6, 2017
Grant Date -
Mar 6, 2014
app pub date -
Mar 22, 2012
filing date -
Mar 22, 2011
priority date (Note) -
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Abstract
The base film of the invention is a base film of a pressure-sensitive adhesive sheet for laminating onto a semiconductor wafer composed of: (A) a layer of a cured product in which a composition including a polyether polyol urethan(meth)acrylate oligomer and an energy ray curable monomer is cured by energy ray irradiation, and (B) a thermoplastic resin layer. The present invention, by using a surface protection sheet, protects a circuit side of a wafer with bumps, prevents collapse of bumps on the circuit side when grinding the back surface, and prevents generation of dimples or cracks on the grinding surface.
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