Wafer edge trim blade with slots

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9676114
APP PUB NO 20130220090A1
SERIAL NO

13408327

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Abstract

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A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTDHSINCHU

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chen, Kei-Wei Tainan, TW 247 1209
Kuo, Chun-Ting Tainan, TW 25 66
Wang, Ying-Lang Tien-Chung Village, TW 181 1289
Wei, Kuo-Hsiu Tainan, TW 28 91

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