Copper wire rod and magnet wire
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United States of America Patent
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Jun 13, 2017
Grant Date -
Jul 30, 2015
app pub date -
Aug 29, 2013
filing date -
Aug 31, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
A copper wire rod with an excellent surface quality and a magnet wire, in which the occurrence of blister defects is suppressed, are provided. The copper wire rod has a composition consisting of: more than 10 ppm by mass and 30 ppm by mass or less of P; 10 ppm by mass or less of O; 1 ppm by mass or less of H; and the balance Cu and inevitable impurities, wherein hydrogen concentration after performing a heat treatment at 500° for 30 minutes in vacuum is 0.2 ppm by mass or less. The magnet wire includes: a drawn wire material produced by using the copper wire rod; and an insulating film coating an outer periphery of the drawn wire material.
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