Wafer level chip scale packaged micro-electro-mechanical-system (MEMS) device and methods of producing thereof
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United States of America Patent
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Jun 20, 2017
Grant Date -
Oct 13, 2016
app pub date -
Apr 10, 2015
filing date -
Apr 10, 2015
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Abstract
Packaged MEMS devices are described. One such device includes a substrate having an active surface with an integrated circuit. Two substrate pads are formed on the substrate; one pad is a closed ring pad. The device also includes a cap wafer with two wafer pads. One of these wafer pads is also a closed ring pad. A hermetic seal ring is formed by a first bonding between the two ring pads. The device has a gap between the substrate and the cap wafer. This gap may be filled with a pressurized gas. An electrical connection is formed by a second bonding between one substrate pad and one wafer pad. An electrical contact is disposed over the cap wafer. The device also includes an insulation layer between the electrical contact and the cap wafer. Methods of producing the packaged MEMS devices are also described.
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