Apparatus for processing surface of substrate and nozzle head
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United States of America Patent
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Jun 20, 2017
Grant Date -
Jun 4, 2015
app pub date -
Jun 24, 2013
filing date -
Jun 25, 2012
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to an apparatus and nozzle head for processing a surface of a substrate. The apparatus includes a substrate support mechanism for supporting the substrate on a substrate support plane in a process zone, a nozzle head for subjecting the surface of the substrate to successive surface reactions of at least a first precursor and a second precursor and a nozzle head support mechanism for supporting the nozzle head at a predetermined distance from the substrate support plane. The nozzle head support mechanism includes a nozzle head support surface and, that the nozzle head is supported to the nozzle head support surface.
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