Method of forming a wire bond having a free end

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United States of America Patent

PATENT NO 9685365
SERIAL NO

13962332

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Abstract

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A method of forming a wire bond having a free end includes joining an end of a metal wire to a conductive element at a surface of a first component, the end of the metal wire being proximate a surface of a bonding tool adjacent an aperture through which the metal wire extends. A predetermined length of the metal wire is drawn out from the aperture. The surface of the bonding tool is used to plastically deform a region of the metal wire between the surface of the bonding tool and a metal element at the surface of the first component. The bonding tool then applies tension to the metal wire to cause a first portion of the metal wire having the end joined to the conductive element to detach from a remaining portion of the metal wire at the plastically deformed region.

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Patent Owner(s)

  • INVENSAS CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Mohammed, Ilyas Santa Clara, US 305 7556

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