Vinyl polymer powder, curable resin composition and cured substance
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Jun 27, 2017
Grant Date -
Dec 1, 2011
app pub date -
Feb 4, 2010
filing date -
Feb 5, 2009
priority date (Note) -
In Force
status (Latency Note)
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Abstract
Disclosed is a vinyl polymer powder which is superior to dispersibility to curable resin compositions, which immediately gives a gel state for curable resin compositions by short-time heating with predetermined temperature, which is with high ion concentration, and which is useful as a pre-gel agent suitable for fields of electronic materials, to provide a curable resin composition comprising the vinyl polymer powder, and to provide a cured substance of the curable resin composition. The vinyl polymer powder of the present invention has an acetone-soluble component of 30% by mass or more, mass average molecular weight of the acetone-soluble component of 100,000 or more, a content of an alkali metal ion of 10 ppm or less, and a volume average primary particle size (Dv) of 200 nm or more.
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International Classification(s)
- C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
- H01L:SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICE....
- C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
- C08F:MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONL....
- C09D:COATING COMPOSITIONS, e.g. PAINTS, VARNISHES, LACQ....
- C08L:COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
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