Connection structure of high-temperature superconducting wire piece, high-temperature superconducting wire using connection structure, and high-temperature superconducting coil using connection structure
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United States of America Patent
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Jun 27, 2017
Grant Date -
Aug 18, 2016
app pub date -
Feb 12, 2016
filing date -
Feb 13, 2015
priority date (Note) -
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Abstract
A connection structure of a multi-layer wire includes at least a substrate, a high-temperature superconducting layer, a tape-type laminated body, a conductor layer, and a passage forming body. The high-temperature superconducting layer is formed on one surface of the substrate. The tape-type laminated body including at least the substrate and the high-temperature superconducting layer. The conductor layer covering an outer periphery of the tape-type laminated body. The passage forming body serving as a flowing path of a superconducting current generated in the high-temperature superconducting wire piece. The passage forming body is bonded by a bonding material is arranged on a side surface of the conductor layer, the side surface being located on an opposite side to the high-temperature superconducting layer with respect to the substrate.
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