Method for creating through-connected vias and conductors on a substrate

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United States of America Patent

PATENT NO 9691634
APP PUB NO 20160293451A1
SERIAL NO

15090164

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Abstract

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A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material has the steps of: (a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected.

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Patent Owner(s)

Patent OwnerAddress
SAMTEC INC520 PARK EAST BOULEVARD NEW ALBANY IN 47150

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Koelling, Fred Foster City, US 27 257

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