Package substrate and manufacturing method thereof
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United States of America Patent
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Jun 27, 2017
Issued Date -
N/A
app pub date -
Sep 7, 2015
filing date -
Jun 30, 2015
priority date (Note) -
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Abstract
A method of manufacturing a package substrate is provided. A first copper layer and a first plating copper layer formed thereon, a first dielectric layer, a second copper layer and a second plating copper layer formed thereon, a second dielectric layer, a third copper layer and a third plating copper layer formed thereon are provided and laminated, so that the first and the second dielectric layers encapsulate edges of the second copper layer and the second plating copper layer to form a temporary carrier. Two circuit structures are formed on two opposite surfaces of the temporary carrier. The temporary carrier and the circuit structures are cut to expose the edges of the second copper layer and the second plating copper layer, and separated along the exposed edges of the second copper layer and the second plating copper layer to form two package substrates independent from each other.
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