Brazing bond type diamond tool with excellent cuttability and method of manufacturing the same
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United States of America Patent
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Jul 4, 2017
Issued Date -
N/A
app pub date -
Aug 3, 2015
filing date -
Sep 7, 2011
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Abstract
The present disclosure provides a brazing bond type diamond tool having excellent cuttability. The diamond tool includes a shank having a body with a thickness of 2 mm or less and a tip portion formed along an edge of the body, the tip portion being thinner than the body; and a brazing bond layer formed on the tip portion of the shank to secure diamond particles having a particle size of 25 to 50 mesh with a brazing bond, wherein the brazing bond layer has a greater thickness than a difference between half the thickness of the shank body and half the thickness of the shank tip portion, such that some part of the shank body can penetrate into a surface of an object to be cut, and the tip portion of the shank has a curved surface at an end thereof.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
EHWA DIAMOND INDUSTRIAL CO LTD | KYUNGGIDO 447804 |
International Classification(s)

- [Classification Symbol]
- [Patents Count]
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Choi, Jong Suk | Seoul, KR | 11 | 48 |
Hong, Jae-Hyun | Hwaseong-si, KR | 4 | 28 |
Song, Young Choul | Osan-si, KR | 3 | 4 |
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