Interfacial alloy layer for improving electromigration (EM) resistance in solder joints

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United States of America Patent

PATENT NO 9698119
SERIAL NO

15159442

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Abstract

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A method of forming a structure for an interfacial alloy layer which is able to improve the electromigration (EM) resistance of a solder joint. More specifically, in this structure, a controlled interfacial alloy layer is provided on both sides of a solder joint. In order to form this structure, aging (maintenance of high-temperature conditions) is performed until an interfacial alloy layer of Cu3Sn has a thickness of at least 1.5 μm.

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Patent Owner(s)

  • INTERNATIONAL BUSINESS MACHINES CORPORATION

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Noma, Hirokazu Kawasaki, JP 9 48
Orii, Yasumitsu Kawasaki, JP 18 98
Toriyama, Kazushige Kawasaki, JP 25 171

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