Via in a printed circuit board

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United States of America Patent

PATENT NO 9706667
SERIAL NO

15001140

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ATTORNEY / AGENT: (SPONSORED)

Importance

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Abstract

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A via in a printed circuit board is composed of a patterned metal layer that extends through a hole in dielectric laminate material. A layer of catalytic adhesive coats walls within the hole. The patterned metal layer is placed over the catalytic adhesive within the hole.

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Patent Owner(s)

Patent OwnerAddress
CATLAM LLC1108 W EVELYN AVE SUNNYVALE CA 94086

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Bahl, Kenneth S Saratoga, US 26 80
Karavakis, Konstantine Pleasanton, US 73 2085

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