Apparatus and method for supplying chemical solution on semiconductor substrate

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United States of America Patent

PATENT NO 9707571
APP PUB NO 20160184839A1
SERIAL NO

14585550

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Abstract

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A method of providing a liquid over a substrate is provided. The method includes providing the liquid over the substrate via a first opening of a flow path formed in a spray nozzle. The method further includes sucking back the liquid away from the first opening of the flow path. The method also includes holding the chemical solution in the flow path to keep a front surface of the chemical solution located in a tapered flow path section of the flow path.

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Patent Owner(s)

Patent OwnerAddress
TAIWAN SEMICONDUCTOR MANUFACTURING CO LTDHSINCHU

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Dai, Yi-Ming Hsinchu, TW 38 105
Su, Pei-Yi Taichung, TW 18 35
Tian, Shih-Jhang Hsinchu, TW 1 5

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