Wire electrical discharge machining apparatus, wire electrical discharge machining system, power supply apparatus, wire electrical discharge machining method, and method of manufacturing semiconductor substrate
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United States of America Patent
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Jul 18, 2017
Grant Date -
Jan 1, 2015
app pub date -
Jun 26, 2014
filing date -
Jun 28, 2013
priority date (Note) -
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Abstract
A wire electrical discharge machining apparatus includes: multiple main rollers around which a wire winds in parallel; multiple workpiece feeding units for feeding the workpiece toward the wire; a machining power supply unit for supplying a machining voltage to the workpiece; and a power supply terminal for supplying the machining voltage to the wire. The multiple workpiece feeding units are respectively arranged at a first position for feeding the workpiece toward a wire portion having a wire plane of the wire and a second position for feeding another workpiece toward another wire portion having another wire plane of the wire. The power supply terminal is arranged at a third position between the first position and the second position. The machining voltage supplied from the single machining power supply unit is supplied to the workpieces to be electrically discharge machined by the multiple workpiece feeding units.
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