Three dimensional structures within mold compound

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United States of America Patent

PATENT NO 9711492
APP PUB NO 20160358897A1
SERIAL NO

14778036

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method including forming at least one passive structure on a substrate by a build-up process; introducing one or more integrated circuit chips on the substrate; and introducing a molding compound on the at least one passive structure and the one or more integrated circuit chips. A method including forming at least one passive structure on a substrate by a three-dimensional printing process; introducing one or more integrated circuit chips on the substrate; and embedding the at least one passive structure and the one or more integrated circuit chips in a molding compound. An apparatus including a package substrate including at least one three-dimensional printed passive structure and one or more integrated circuit chips embedded in a molding material.

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Patent Owner(s)

  • INTEL CORPORATION

International Classification(s)

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Albers, Sven Regensburg, DE 57 771
Meyer, Thorsten Regensburg, DE 298 5154
Reingruber, Klaus Langquaid, DE 44 923
Wolter, Andreas Regensburg, DE 88 1004

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