Deposition apparatus and deposition method using the same

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United States of America Patent

PATENT NO 9713818
APP PUB NO 20160105971A1
SERIAL NO

14664672

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Abstract

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A deposition apparatus and a deposition method are disclosed. In one aspect, the deposition apparatus includes an electrostatic chuck and a tensile plate attached to and formed over the electrostatic chuck. The deposition apparatus further includes an elevation unit configured to move the tensile plate towards the substrate and a tensile unit configured to apply a tensile force to the tensile plate to expand the tensile plate.

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Patent Owner(s)

Patent OwnerAddress
SAMSUNG DISPLAY CO LTDYONGIN-SI

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Han, Jeongwon Yongin, KR 27 55

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