Seed layer deposition in microscale features

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United States of America Patent

PATENT NO 9714474
APP PUB NO 20110240481A1
SERIAL NO

12755198

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Abstract

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A method and system for coating the interior surfaces of microscale hole features fabricated into the substantially planar surface of a work piece. The method comprises providing a work piece with a barrier metal coating that is substantially continuous and uniform both along the planar surface of the work piece and the inner surfaces of the microscale hole features wherein said barrier metal coating is applied by a substantially surface reaction limited process. The workpiece is provided with a coating, on the planar surface of the work piece, of a thick metal layer anchored to the barrier metal coat and disposed to provide substantially uniform electrical conduction capability to the microscale features located throughout and across the workpiece. An electrical contact path is provided to the electrically conductive coating at the perimeter of the work piece. The workpiece is immersed in a chemical bath, causing said chemical bath to fully contact the interior surfaces of the microscale hole features, said chemical bath containing metal ions suitable for electrodeposition. An electric potential is applied at the perimeter of the work piece to cause electrodeposition of metal ions onto all surfaces of the work piece including the interior surfaces of the microscale hole features to a predetermined finish coating in one step.

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Patent Owner(s)

Patent OwnerAddress
ASMPT NEXX INC900 MIDDLESEX TURNPIKE BLDG 6 BILLERICA MA 01821

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Chiu, Johannes Chelsea, US 9 70
Goodman, Daniel Lexington, US 81 1874
Keigler, Arthur Wellesley, US 50 581
Liu, Zhenqiu Northboro, US 13 153

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