Component which can be produced at wafer level and method of production

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United States of America Patent

PATENT NO 9718673
SERIAL NO

14787551

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A component which can be produced at wafer level has a first chip and a second chip connected thereto. The connection is (at least partially) established via a first and a second connecting structure and a first and a second contact structure of the second chip. An adaptation structure between the first chip and the first connecting structure equalizes a height difference between the first and the second contact structure.

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Patent Owner(s)

  • TDK CORPORATION

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Pahl, Wolfgang Munich, DE 66 1819

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