Thin capping for MEMS devices
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United States of America Patent
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Aug 1, 2017
Grant Date -
Jul 21, 2016
app pub date -
Aug 26, 2014
filing date -
Aug 26, 2013
priority date (Note) -
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status (Latency Note)
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Abstract
A device includes a base substrate (700) with a micro component (702) attached thereto. Suitably it is provided with routing elements (704) for conducting signals to and from the component (702). It also includes spacer members (706) which also can act as conducting structures for routing signals vertically. There is a capping structure (708) of a glass material, provided above the base substrate (700), bonded via the spacer members (706), preferably by eutectic bonding, wherein the capping structure (708) includes vias (710) including metal for providing electrical connection through the capping structure. The vias can be made by a stamping/pressing method entailing pressing needles under heating to soften the glass and applying pressure, to a predetermined depth in the glass. However, other methods are possible, e-g- drilling, etching, blasting.
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