In-situ conditioning for vacuum processing of polymer substrates

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United States of America Patent

PATENT NO 9719177
SERIAL NO

13877960

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Abstract

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An etching chamber is equipped with an actively-cooled element preferentially adsorbs volatile compounds that are evolved from a polymeric layer of a wafer during etching, which compounds will act as contaminants if re-deposited on the wafer, for example on exposed metal contact portions where they may interfere with subsequent deposition of metal contact layers. In desirable embodiments, a getter sublimation pump is also provided in the etching chamber as a source of getter material. Methods of etching in such a chamber are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
EVATEC AGHAUPTSTRASSE 1A TRÜBBACH 9477

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Weichart, Juergen Balzers, LI 16 108

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