Method of providing a flexible semiconductor device and flexible semiconductor device thereof

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9721825
APP PUB NO 20160225653A1
SERIAL NO

15096772

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Abstract

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Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed.

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Patent Owner(s)

Patent OwnerAddress
ARIZONA BOARD OF REGENTS A BODY CORPORATE OF THE STATE OF ARIZONA ACTING FOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY1475 N SCOTTSDALE ROAD SKYSONG SUITE 200 SCOTTSDALE AS 85257

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Howard, Emmett M Tempe, US 10 49
Loy, Douglas E Chandler, US 15 315
Marrs, Michael A Phoenix, US 2 32
Munizza, Nicholas Gilbert, US 8 76

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